Version 2026-10-04
This is a draft template written for an educational prototype, not reviewed legal advice. Have it checked by qualified counsel before relying on it for a real product or a different jurisdiction.
ChipGurukul is an educational, illustrative 3D lab for exploring semiconductor packaging concepts — package types, assembly steps, materials and common defects. Dimensions, materials, process sequences and defect descriptions throughout the lab are simplified for teaching and are explicitly marked as illustrative; none of it is a datasheet, a manufacturing specification, or engineering or quality-assurance guidance for real production.
You need an account to use the lab. You agree to:
We do not currently verify email addresses at signup. Do not use someone else’s email address to create an account.
Use the lab for personal learning, teaching or evaluation. Do not attempt to bypass login, access another user’s account, disrupt the service, scrape or republish its content at scale, or use it in a way that violates applicable law.
The lab is provided “as is,” without warranty of any kind, express or implied. Content is illustrative and may contain errors, simplifications or omissions; it is provided for learning, not for certifying, specifying or approving any real package, process or material.
To the fullest extent permitted by law, ChipGurukul and its operator are not liable for any indirect, incidental or consequential damages arising from your use of, or inability to use, the lab.
We may update these terms as the lab changes. Continued use after an update means you accept the revised terms. Material changes will update the version date above.
You may stop using the lab at any time. We may suspend or terminate accounts that violate these terms.
Questions about these terms: replace this paragraph with a real support or legal contact address before launch.
← Back to sign up